Koenig & Bauer’s Digital & Webfed division has made a “world-first” demonstration of a new CI flexo technology designed to address demands for efficient, fast makeready and job changeover at its Technology Days 2026 event in Würzburg, Germany.
EasyTronic CI Flexo features a single-sided, heat-resistant belt that threads the entire web path, including the complex CI section, and provides automatic web feed and time savings of up to 80 percent compared to conventional systems, the company claims. The new technology has been developed utilising Koenig & Bauer’s decades of experience from newspaper printing.
At the two-day event, the company also highlighted the role of its XD Pro CI flexo press as a production workhorse in modern packaging production, with live demonstrations showing the press running a range of applications, including stand-up pouches, chocolate bar packaging, mono-material films, and fibre-based packaging. Koenig & Bauer said this underlined the XD Pro’s versatility across key packaging segments. All jobs were printed in Extended Colour Gamut.
There were also demonstrations of the RotaJET digital printing system, and how connected packaging can complement established production processes. A production “race” between the XD Pro and the RotaJET illustrated how CI flexo and digital can work side by side within broader packaging workflows, depending on application and market requirements.
“These sessions showed how flexo and digital technologies can be applied in realistic production environments to meet specific packaging, compliance and brand requirements,” explained Christian Steinmaßl, CEO for Special & New Technologies.
Philipp Zimmermann, CEO of Koenig & Bauer Digital & Webfed, concluded that the Technology Days 2026 event had “made clear that flexo remains a key technology for the packaging industry”, adding: “With the XD Pro, we are offering the workhorse of modern flexo production, and with innovations such as EasyTronic CI Flexo, and our USP in web infeed, we are continuing to develop that technology for new market requirements.”
