Lintec has developed an easy-to-apply, blister-free label stock with an adhesive design that provides a release mechanism for volatile gases.
Previously, the technique used to achieve an adhesive with blister-free ability involved transcripting the concave-convex shape to the adhesive surface using embossed release liner upon coating.
This label stock developed with a new manufacturing process differs from the conventional blister-free label stock in the way of forming a concave-convex shape on the surface of the adhesive, with their shape self-formed to provide bubble-free ability.
Due to the random orientation of the concave-convex morphology of the adhesive surface, there are fewer problems with the punching process, and the adhesive surface doesn’t select the release liner surface so that back-slitting is possible. Another feature of this new product is that it has superior retention of concave-convex shape, and therefore shows little deterioration in performance even when repeatedly placed in a high-temperature environment.
